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Creep, Strength and Moisture Absorption of Adhesive Bonded FRP Joints

机译:粘接剂FRp接头的蠕变,强度和吸湿性

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摘要

The effects of the environment on adhesive bonded single lap joints formed using XMC-3 and SMC-R50 composites were investigated. Tests were performed at temperatures of 23C and 93C with test coupons immersed in air, water, and 5% NaCl water mixture. The weight changes of both bonded joints (XMC-3 to SMC-R50 and SMC-R50 to SMC-R50) and unbonded materials were measured. Data were also ob tained showing the effects of moisture, temperature, and applied load on changes in weight, on creep deformation, lap shear strength, and separation modes of the joints.
机译:研究了环境对使用XMC-3和SMC-R50复合材料形成的粘合剂粘结的单搭接接头的影响。在23℃和93℃的温度下进行测试,将测试试样浸入空气,水和5%NaCl水混合物中。测量了两个粘结接头(XMC-3至SMC-R50和SMC-R50至SMC-R50)和未粘结材料的重量变化。还获得了表明湿度,温度和外加载荷对重量变化,蠕变变形,搭接剪切强度和接头分离方式的影响的数据。

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